Corebai participated in the third "Xin Dong Beijing" IC Industry Forum organized by the Zhongguancun Integrated Circuit Design Park.
  • Released:2019-09-12 00:00:49
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The third "Xin Dong Beijing" Zhongguancun IC Industry Forum, hosted by the Zhongguancun Integrated Circuit Design Park, was grandly held on September 11th in Beijing. The forum's theme was "Building Industry Ecology, Accelerating Independent Chip Innovation," focusing on topics such as global semiconductor industry trends, IC independent innovation and talent cultivation, key chip independent controllability and industrial ecosystem construction, and capital-driven industry innovation. In-depth discussions were conducted on increasing industry investment and building a virtuous ecosystem of "talent + innovation + investment + industrial base," which was the core theme of this event.


The third "Xin Dong Beijing" Zhongguancun IC Industry Forum, organized by the Zhongguancun Integrated Circuit Design Park, was grandly held on September 11th in Beijing. The forum's theme was "Building Industry Ecology, Accelerating Independent Chip Innovation," focusing on topics such as global semiconductor industry trends, IC independent innovation and talent cultivation, key chip independent controllability and industrial ecosystem construction, and capital-driven industry innovation. In-depth discussions were conducted on increasing industry investment and building a virtuous ecosystem of "talent + innovation + investment + industrial base," which was also the core theme of this event.

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This forum, organized by the Zhongguancun Integrated Circuit Design Park, includes specific agendas such as the opening ceremony, a high-level forum, and three sub-forums focusing on IC design and independent innovation, industry and capital, and talent development. During the conference, experts discussed hot topics such as global semiconductor industry trends, the construction of Beijing's integrated circuit ecosystem, transitioning from "Xin Dong" to action, innovation and breakthroughs in independent key chips, new investment opportunities in semiconductors, and the integration of talent development and industry-education.

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Coebai Microelectronics (Beijing) Co., Ltd. stood out at this forum by showcasing a variety of new products, demonstrating not only the impressive research and development capabilities and innovative creativity of this company established for 10 years but also earning praise and attention from all sides. At this exhibition, XINBAI Microelectronics displayed a total of 4 meticulously developed products:


CBM08AD1500QP:

Manufactured using CMOS technology, this semiconductor integrated circuit features a combination of folding and interpolation structure. The circuit includes a sample/hold amplifier, fold amplifier, bandgap voltage reference, clock circuit, LVDS output, among others. It boasts high sampling rate, low power consumption, minimal linear error, automatic gain and offset calibration, and 3-line interface control. With dual-channel ultra-high-speed A/D converters, SDR or DDR output clock selection, each channel has a sampling rate of 1.5GSPS which can be doubled using time-interleaved mode, ensuring excellent multi-ADC synchronization performance.


CBM99D57:

Capable of implementing I/Q modulator and up-converter functions in various high-end communication systems. Internally integrated with a high-speed direct digital synthesizer (DDS), high-speed 14-bit digital-to-analog converter (DAC), clock multiplier circuit, digital filters, and other DSP functions. This chip provides excellent performance in data transmission baseband up-conversion for wired or wireless communication systems in terms of speed, power consumption, and spectral performance. Supporting 16-bit serial input I/Q baseband data, it can be programmed as a single-frequency sine wave source or interpolation DAC mode. It achieves high-speed internal sampling clock through internal oscillator, high-speed divider circuit, and low-noise phase-locked loop (PLL).


CBM99D10:

A direct digital frequency synthesizer (DDS) with a built-in 14-bit DAC supporting up to 1 GSPS sampling rate, capable of generating a 400 MHz sine wave. Users can control the DDS output signal via internal frequency, phase, and amplitude control words. The DDS allows rapid frequency hopping with a tuning resolution of 0.23 Hz using a 32-bit accumulator at a 1 GSPS sampling rate. It also features fast phase and amplitude switching functionality. Users can program the internal control registers of CBM99D10 via a serial I/O port. CBM99D10 integrates static RAM supporting various combinations of frequency, phase, and/or amplitude modulation. It also supports user-defined digitally controlled ramp operation modes where frequency, phase, or amplitude varies linearly over time. The high-speed parallel data input port of CBM99D10 enables direct frequency, phase, amplitude, or polarization modulation to support advanced modulation features.


CBM1001:

A cost-effective high-speed Ethernet controller chip integrating a 10/100M PHY and MAC layer, along with a built-in 16K-byte SRAM and a universal processor access interface externally provided. This chip offers low power consumption, high performance characteristics, supports 3.3V IO levels, and accepts 5V input IO voltage. It supports 8-bit and 16-bit data interfaces for accessing the internal SRAM. The built-in PHY supports UTP3,4,5 10Base-T and UTP5 100Base-TX, fully compliant with IEEE 802.3u specifications, and features automatic negotiation function.


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Corebai Microelectronics, as a powerhouse enterprise with deep roots in the Chinese integrated circuit industry, showcased its self-developed products at this forum, attracting significant attention from related enterprises, universities, research institutes, investment firms, news media, and receiving praise from various parties. Through this industrial forum platform, XINBAI Microelectronics aims to let more people learn and understand about their company. Over the past decade, guided by the entrepreneurial principles of "Specializing in Core Development," "Using Core for Services," and "Creating Core Future," XINBAI Microelectronics has continuously accumulated experience, enhanced its research and development capabilities, and rapidly grown within a few years. It has accumulated over 40 layout design patents, successfully developed and launched a rapidly increasing number of self-developed products, now totaling over 100 products across three major categories, all complying with EU RoHS standards and green environmental standards. XINBAI Microelectronics has remained true to its entrepreneurial aspirations, steadily accumulating strength over the past ten years, which led to its outstanding performance at this forum.


In the future, XINBAI Microelectronics will continue to uphold its corporate mission of creating an intelligent society through technological innovation, independently developing and introducing more new products, aiming to become a trustworthy and respected first-class enterprise, contributing to the enhancement of the country's independent substitution capability in integrated circuits. Taking this forum as an opportunity, XINBAI Microelectronics hopes to establish a platform for communication, exchange, and collaboration with the Chinese IC industry, paving the way for new ideas in the upgrade and development of the entire Chinese integrated circuit industry. Excitement surrounds the anticipation of the exquisite products and vitality that XINBAI Microelectronics will bring in its future development.


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